We can provide the OEM of PCB Job. It's include DIP and SMT. Besides PCB assembly, we also provide the service of plastic mold, metal stamping and fully assembl....
The tradition technology in the electronic industry used ( silicon substrate) and (glass substrate) as the primary procedure and those primarily system regulati....
Flexible circuit board (FPC) used in the applications and markets from medical equipment, telecommunications, computer peripherals, instrumentation and industri....
1. Right angel PCB mount.
2. Impedance: 50 ohm.
3. Body material: brass.
4. Center material: brass.
5. Finish: nickel.
We can provide the OEM of PCB Job. It's include DIP and SMT. Besides PCB assembly, we also provide the service of plastic mold, Metal stamping and fully assembl....
1.Flexible wiring parts:
(1) Printer head circuit
(2) Hinge
(3) Flying head
(4) Date/servo cable
(5) Floppy disc cable
2.Special FPC:
(1) Surface ....
1. By definition, flexible circuits, also known as "FPC (Flexible printed circuits)" or "flex circuits", is a pattern of conductors created ....
1. Multi-layers with buried and blind via.
2. Surface: HASL, immersion gold, Entek,etc.
3. Solder mask: green, white, yellow or red,etc.
4. Standard FR1, F....
The products purpose is mobile phone, communications satellite, wireless communication M/C.
1. Conductor(copper) thickness: 0.5oz, 1oz or 2oz(RA or ED copper).
2. Adhesive: acrylic, 3M.
3. Stiffener: mylar or kapton.
1. Conductor: 1/2oz, 1oz, 2oz, ED(RA) copper.
2. Coverlay: polymide, polyester or solder mask .
3. Thickness: 1/2 mil, 2 mil, 3mil, 5mil.
4. Plating: tin-l....
We can provide the OEM of PCB Job. It's include DIP and SMT. Besides PCB assembly, we also provide the service of plastic mold, metal stamping and fully assembl....
1. Multi-layers with buried and blind via.
2. Surface: HASL, Immersion Gold, Entek, etc.
3. Solder mask: green, white, yellow or red, etc.
4. Standard FR1,....
1. Multi-layers with buried and blind via.
2. Surface: HASL, immersion gold, entek,etc.
3. Solder mask: green, white, yellow or red, etc.
4. Standard FR1, ....
1. Multi-layers with buried and blind via.
2. Surface: HASL, immersion gold, entek,etc.
3. Solder mask: green, white, yellow or red,etc.
4. Standard FR1, F....
